Flexible Integrated Circuit Packaging

Case ID: 012-0012-Li

­The George Washington University has invented a way to package integrated circuits (ICs) in a flexible, twistable, and stretchable format.  In addition to many applications in wearable electronics, flexible circuits can be useful in any situation where a circuit must conform to a non-uniform space, or allow for deflection during operation.

This method enables performance improvements over other flexible circuit technologies by allowing for the use of any standard IC on the market, including CMOS chips.  The process enables new applications to take advantage of the high performance, low cost, and scalability characteristics of available CMOS chips.

Liquid metal connections maintain robust functionality during bending and stretching.  These Gallium based metal alloy connections can also be used to create on-chip coils, antennas, and strain gauges, enabling a myriad of applications, including magnetic, RF, display, and sensing applications.  The inventors have demonstrated proof-of-concept in a diagnostic, lab-on-a-chip application by adding microfluidic sample delivery channels to the package design.  Beyond diagnostics, flexible packaging has broad applicability to consumer electronics.

Figure: A flexible circuit maintains stable performance while bent around a finger.


  • Wearable Electronics
  • Deformable Electronics


  • Compatible with any available IC
  • Use proven, high performance, low cost CMOS chips

Patent Information:

Title App Type Country Patent No. File Date Issued Date Patent Status
Microfluidic Integration Packaging US Utility United States 9,116,145 12/14/2012 8/25/2015 Issued

For Information, Contact:

Michael Harpen
Licensing Manager
George Washington University


Zhenyu Li
Mona Zaghloul
Bowei Zhang
Can Korman